Aluminum nitride substrates are ceramic substrates made of aluminum nitride (AlN), a material with excellent thermal conductivity and electrical insulation properties. They are used in various electronic applications where high heat dissipation and high electrical insulation are required.
Property Index of ALN Aluminum Nitride ceramics | |||||
Property Sort | Characteristic | Unit | AN170 | AN200 | AN220 |
Basic Properties | Appearance/color | — | Gray | Gray | Beige |
Water absorption | % | 0 | 0 | 0 | |
Volume density | g/cm3 | ≥3.30 | ≥3.30 | ≥3.26 | |
Surface roughness Ra | μm | 0.1~0.6 | 0.1~0.6 | 0.1~0.6 | |
Camber | (length ‰) | ≤2‰ | ≤2‰ | ≤2‰ | |
Thermal Properties | Thermal conductivity (20-30℃) | W/m.k | ≥170 | ≥200 | ≥220 |
Coefficient of Thermal expansivity (20℃~300℃) |
×10-6/℃ | 4.4 | 4.6 | 4.5 | |
Coefficient of Thermal expansivity(40℃~800℃) |
×10-6/℃ | 5.2 | 5.2 | 5.2 | |
Mechanical Properties | Flexural/Bending strength | MPa | ≥420 | ≥300 | ≥200 |
Modulus of elasticity | GPa | 320 | 310 | 310 | |
Moh''s hardness | - | 8 | 8 | 8 | |
Electrical properties | Dielectric constant (1MHz 25℃) | - | 8.9 | 8.6 | 8.5 |
(1MHz 25℃) Dielectric loss | ×10-4 | 2.8 | 2 | 2 | |
Dielectric strength | KV/mm | ≥17 | ≥16 | ≥15 | |
Volume resistivity | Ω.cm | ≥1014 | ≥1014 | ≥1013 |
Regular specification of AlN Aluminum Nitride substrates/plate and Aluminum Nitride wafer | ||||||||||||
Thickness(mm) | L*W( mm) | |||||||||||
0.381 |
2″* 2″ 50.8mm*50.8mm |
3″*3″ 76.2mm*76.2mm | 4″* 4″ 101.6mm*101.6mm | 4.5″* 4.5″ 114.3mm*114.3mm | 127*127mm 138*190mm |
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0.5 | ||||||||||||
0.635 | ||||||||||||
1 | ||||||||||||
1.5 | ||||||||||||
Thickness(mm) | Diameter(mm) | |||||||||||
1 |
Φ16 Φ19 |
Φ20 Φ26 |
Φ30 Φ35 |
Φ40 Φ45 |
Φ50 Φ52 |
Φ60 | Φ75 | Φ80 | Φ200 | |||
1.2 | ||||||||||||
1.5 | ||||||||||||
2 | ||||||||||||
2.5 | ||||||||||||
3 | ||||||||||||
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