Aluminum nitride (AlN) plate is a ceramic substrate material with high thermal conductivity and excellent electrical insulation properties. It is widely used in electronic and semiconductor industries for its ability to dissipate heat and withstand high voltages.
Property Index of ALN Aluminum Nitride ceramics | |||||
Property Sort | Characteristic | Unit | AN170 | AN200 | AN220 |
Basic Properties | Appearance/color | — | Gray | Gray | Beige |
Water absorption | % | 0 | 0 | 0 | |
Volume density | g/cm3 | ≥3.30 | ≥3.30 | ≥3.26 | |
Surface roughness Ra | μm | 0.1~0.6 | 0.1~0.6 | 0.1~0.6 | |
Camber | (length ‰) | ≤2‰ | ≤2‰ | ≤2‰ | |
Thermal Properties | Thermal conductivity (20-30℃) | W/m.k | ≥170 | ≥200 | ≥220 |
Coefficient of Thermal expansivity (20℃~300℃) |
×10-6/℃ | 4.4 | 4.6 | 4.5 | |
Coefficient of Thermal expansivity(40℃~800℃) |
×10-6/℃ | 5.2 | 5.2 | 5.2 | |
Mechanical Properties | Flexural/Bending strength | MPa | ≥420 | ≥300 | ≥200 |
Modulus of elasticity | GPa | 320 | 310 | 310 | |
Moh''s hardness | - | 8 | 8 | 8 | |
Electrical properties | Dielectric constant (1MHz 25℃) | - | 8.9 | 8.6 | 8.5 |
(1MHz 25℃) Dielectric loss | ×10-4 | 2.8 | 2 | 2 | |
Dielectric strength | KV/mm | ≥17 | ≥16 | ≥15 | |
Volume resistivity | Ω.cm | ≥1014 | ≥1014 | ≥1013 |
Regular specification of AlN Aluminum Nitride substrates/plate and Aluminum Nitride wafer | ||||||||||||
Thickness(mm) | L*W( mm) | |||||||||||
0.381 |
2″* 2″ 50.8mm*50.8mm |
3″*3″ 76.2mm*76.2mm | 4″* 4″ 101.6mm*101.6mm | 4.5″* 4.5″ 114.3mm*114.3mm | 127*127mm 138*190mm |
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0.5 | ||||||||||||
0.635 | ||||||||||||
1 | ||||||||||||
1.5 | ||||||||||||
Thickness(mm) | Diameter(mm) | |||||||||||
1 |
Φ16 Φ19 |
Φ20 Φ26 |
Φ30 Φ35 |
Φ40 Φ45 |
Φ50 Φ52 |
Φ60 | Φ75 | Φ80 | Φ200 | |||
1.2 | ||||||||||||
1.5 | ||||||||||||
2 | ||||||||||||
2.5 | ||||||||||||
3 | ||||||||||||
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