96 Alumina Ceramic Substrate for LED Insulation plate
Alumina ceramic substrates are thin, flat plates made from high-purity alumina materials that are used as a base or support for electronic components. They are commonly used in electronic devices such as sensors, microelectronics, and other applications where thermal and electrical conductivity, high strength, and chemical stability are required.
Alumina ceramic substrates offer several advantages, including high thermal conductivity, excellent mechanical strength and hardness, chemical stability, and resistance to wear and abrasion. These properties make them ideal for use in harsh environments where electronic components need to function reliably.
Features&Benefits:
High mechanical strength and hardness |
Excellent wear resistance and chemical stability |
Good electrical insulation properties |
High thermal conductivity |
Low thermal expansion coefficient |
Biocompatible and non-toxic |
Electronics: as a substrate for electronic components such as integrated circuits, transistors, and diodes. |
Automotive: as a substrate for automotive sensors, electronic control units, and catalytic converters. |
Aerospace: as a substrate for aircraft engine sensors and electronic systems. |
Medical: as a substrate for implantable medical devices such as pacemakers and hearing aids. |
Industrial: as a substrate for high-temperature furnace components, cutting tools, and wear-resistant parts. |
Alumina Ceramic Substrate Material Property | ||||
Item | Unit | 96% Al2O3 | 99.6% Al2O3 | |
Mechanical Properties | ||||
Color | / | / | White | Ivory |
Density | Drainage Method | g/cm3 | ≥3.70 | ≥3.95 |
Light Reflectivity | 400nm/1mm | % | 94 | 83 |
Flexural Strength | Three Point Bending | MPa | >350 | >500 |
Fracture Toughness | Indentation Method | MPa·m1/2 | 3 | 3 |
Vickers Hardness | Load 4.9N | GPa | 14 | 16 |
Young's Modulus | Stretching Method | GPa | 340 | 300 |
Water Absorption | % | 0 | 0 | |
Camber | / | Length ‰ | T≤0.3: ≤5‰, Others: ≤3‰ | ≤3‰ |
Thermal Properties | ||||
Max. Service Temperature (non-loading) | / | ºC | 1200 | 1400 |
CTE (coefficient of thermal expansion) | 200-800ºC | 1×10-6/ºC | 7.8 | 7.9 |
Thermal Conductivity | 25ºC | W/m·K | >24 | >29 |
Thermal Shock Resistance | 800ºC | ≥10 Times | No Crack | No Crack |
Specific Heat | 25ºC | J/kg·k | 750 | 780 |
Electrical Properties | ||||
Dielectric Constant | 25ºC, 1MHz | / | 9.4 | 9.8 |
Dielectric Loss Angle | 25ºC, 1MHz | ×10^-4 | ≤3 | ≤2 |
Volume Resistivity | 25ºC | Ω·cm | ≥10^14 | ≥10^14 |
Dielectric Strength | DC | KV/mm | ≥15 | ≥15 |
Alumina Ceramic Substrate Production Specifications | |||||||
99.6% Al2O3 | |||||||
Thickness (mm) | Maximum Size (mm) | Shape | Molding Technique | ||||
As Fired | Lapped | Polished | Rectangular | Square | Round | ||
0.1-0.2 | 50.8 | 50.8 | √ | √ | Tape Casting | ||
0.25 | 114.3 | 114.3 | √ | Tape Casting | |||
0.38 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
0.5 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
0.635 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
Other particular thicknesses within the thickness range of 0.1-0.635mm can be achieved by lapping. | |||||||
96% Al2O3 | |||||||
Thickness (mm) | Maximum Size (mm) | Shape | Molding Technique | ||||
As Fired | Lapped | Polished | Rectangular | Square | Round | ||
0.25 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
0.3 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
0.38 | 140×190 | √ | Tape Casting | ||||
0.5 | 140×190 | √ | Tape Casting | ||||
0.635 | 140×190 | √ | Tape Casting | ||||
0.76 | 130×140 | √ | Tape Casting | ||||
0.8 | 130×140 | √ | Tape Casting | ||||
0.89 | 130×140 | √ | Tape Casting | ||||
1 | 280×240 | √ | Tape Casting | ||||
1.5 | 165×210 | √ | Tape Casting | ||||
2 | 500×500 | √ | Tape Casting | ||||
Other particular thicknesses within the thickness range of 0.1-2.0mm can be achieved by lapping. |