Alumina Ceramic Substrates

Alumina Ceramic Substrates

Product

Alumina Ceramics

Alumina Ceramic Tube

Alumina Ceramic Rod

Alumina Ceramic Substrates

Alumina Ceramic Disc

Alumina Ceramic Plate

Alumina Ceramic Roller

Alumina Ceramic Crucible

Alumina Ceramic Ring

Alumina Ceramic Part

Ceramic Ignition Electrode series

Zirconia Ceramics

Zirconia Ceramic Tube

Zirconia Ceramic Rod

Zirconia Ceramic Plate

Zirconia Ceramic Disc

Zirconia Ceramic Crucible

Zirconia Ceramic Ring

Zirconia Part

Zirconia Knife

Silicon Carbide Ceramics

RBSiC

SSiC

R-SiC

Aluminum Nitride Ceramics

Aluminum Nitride Substrates

Aluminum Nitride Tube

Aluminum Nitride Plate

Aluminum Nitride Disc

Aluminum Nitride Part

Boron Carbide Ceramics

Boron Carbide Tiles

Boron Carbide Plate

Boron Carbide Insert

Boron Carbide Bushing

Boron Carbide Tube

Boron Carbide Nozzle

Boron Carbide Ball

Boron Nitride Ceramics (BN)

Boron Nitride Tube

Boron Nitride Plate

Boron Nitride Ring

Boron Nitride Nozzle

Boron Nitride Crucible

Boron Nitride Part

Pyrolytic Boron Nitride (PBN)

PBN Crucible

PBN Plate

PBN Tube

PBN Ring

PBN Part

Silicon Nitride (Si3N4) Ceramics

Silicon Nitride Substrates

Silicon Nitride Bearing

Silicon Nitride Igniter

Silicon Nitride Balls

Silicon Nitride Tube

Silicon Nitride Part

Beryllium Oxide Ceramics

BeO Tube

BeO Substrates

BeO Ring

Mullite Ceramics

Mullite Ceramic Part

Mullite Ceramic Tube

Mullite Ceramic Plate

GaN Ceramics

GaN Substrates

GaN wafer

Graphite

Graphite Crucible

Graphite Rotors and Shaft

Graphite Plate

Graphite Rod

Graphite Tube

Graphite Ring

Graphite Heater

Graphite Launder

Graphite Cylinde

Graphite Nozzle

Graphite Blocks

Quartz

Quartz Tube

Quartz Rod

Quartz Plate

Quartz Crucible

Quartz Ring

Tugnsten Carbide

Tungsten Carbide Rod

Tungsten Carbide Strips/Plate

Tungsten Carbide Burrs

Tungsten Carbide Dies

Tungsten Carbide Balls

Aluminium Oxide Substrates High Purity 99% 96% Ceramic Plate

96 Alumina Ceramic Substrate for LED Insulation plate

Alumina ceramic substrates are thin, flat plates made from high-purity alumina materials that are used as a base or support for electronic components. They are commonly used in electronic devices such as sensors, microelectronics, and other applications where thermal and electrical conductivity, high strength, and chemical stability are required.

Alumina ceramic substrates offer several advantages, including high thermal conductivity, excellent mechanical strength and hardness, chemical stability, and resistance to wear and abrasion. These properties make them ideal for use in harsh environments where electronic components need to function reliably.

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Product Description

Features&Benefits:

High mechanical strength and hardness
Excellent wear resistance and chemical stability
Good electrical insulation properties
High thermal conductivity
Low thermal expansion coefficient
Biocompatible and non-toxic

Markets & Applications

Electronics: as a substrate for electronic components such as integrated circuits, transistors, and diodes.
Automotive: as a substrate for automotive sensors, electronic control units, and catalytic converters.
Aerospace: as a substrate for aircraft engine sensors and electronic systems.
Medical: as a substrate for implantable medical devices such as pacemakers and hearing aids.
Industrial: as a substrate for high-temperature furnace components, cutting tools, and wear-resistant parts.

Specification

Alumina Ceramic Substrate Material Property
Item Unit 96% Al2O3 99.6% Al2O3
Mechanical Properties        
Color / / White Ivory
Density Drainage Method g/cm3 ≥3.70 ≥3.95
Light Reflectivity 400nm/1mm % 94 83
Flexural Strength Three Point Bending MPa >350 >500
Fracture Toughness Indentation Method MPa·m1/2 3 3
Vickers Hardness Load 4.9N GPa 14 16
Young's Modulus Stretching Method GPa 340 300
Water Absorption    % 0 0
Camber / Length ‰ T≤0.3: ≤5‰, Others: ≤3‰ ≤3‰
Thermal Properties        
Max. Service Temperature (non-loading) / ºC 1200 1400
CTE (coefficient of thermal expansion) 200-800ºC 1×10-6/ºC 7.8 7.9
Thermal Conductivity 25ºC W/m·K >24 >29
Thermal Shock Resistance 800ºC ≥10 Times No Crack No Crack
Specific Heat 25ºC J/kg·k 750 780
Electrical Properties        
Dielectric Constant 25ºC, 1MHz / 9.4 9.8
Dielectric Loss Angle 25ºC, 1MHz ×10^-4 ≤3 ≤2
Volume Resistivity 25ºC Ω·cm ≥10^14 ≥10^14
Dielectric Strength DC KV/mm ≥15 ≥15
Alumina Ceramic Substrate Production Specifications
99.6% Al2O3
Thickness (mm) Maximum Size (mm) Shape Molding Technique        
As Fired Lapped Polished Rectangular Square Round    
0.1-0.2   50.8 50.8   Tape Casting
0.25   114.3 114.3     Tape Casting
0.38 120 114.3 114.3     Tape Casting
0.5 120 114.3 114.3     Tape Casting
0.635 120 114.3 114.3     Tape Casting
Other particular thicknesses within the thickness range of 0.1-0.635mm can be achieved by lapping.
96% Al2O3
Thickness (mm) Maximum Size (mm) Shape Molding Technique        
As Fired Lapped Polished Rectangular Square Round    
0.25 120 114.3 114.3     Tape Casting
0.3 120 114.3 114.3     Tape Casting
0.38 140×190         Tape Casting
0.5 140×190         Tape Casting
0.635 140×190         Tape Casting
0.76 130×140         Tape Casting
0.8 130×140         Tape Casting
0.89 130×140         Tape Casting
1 280×240         Tape Casting
1.5 165×210         Tape Casting
2 500×500         Tape Casting
Other particular thicknesses within the thickness range of 0.1-2.0mm can be achieved by lapping.
KT offers a wide range of sizes and thicknesses.  If your requirements are outside those listed, we can customize our products to
meet your needs. Pricing and availability may be subject to change.